Microelectronics, Volume. 51, Issue 3, 347(2021)
Research on Thin-Film HIC Process Based on Gold-Aluminum Bonding Failure
References(3)
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YANG Jiayi, WANG Xuguang, QIN Wenlong, YANG Liangliang. Research on Thin-Film HIC Process Based on Gold-Aluminum Bonding Failure[J]. Microelectronics, 2021, 51(3): 347
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Received: Oct. 28, 2020
Accepted: --
Published Online: Mar. 11, 2022
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