Chinese Journal of Lasers, Volume. 47, Issue 1, 0105002(2020)

Improving Slow-Axis Laser Beam Quality of Semiconductor Laser with Edge Adiabatic Package

Biyao Zhao1,2, Hongqi Jing1、*, Li Zhong1,2, Yuxuan Man1,2, Xuefeng Ban1,2, Suping Liu1, and Xiaoyu Ma1,2
Author Affiliations
  • 1National Engineering Research Center for Optoelectronic Devices, Institute of Semiconductors,Chinese Academy of Sciences, Beijing 100083, China
  • 2College of Materials Science and Optoelectronic Technology, University of Chinese Academy of Sciences,Beijing 100049, China
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    Figures & Tables(14)
    Diagram of edge adiabatic package principle
    Temperature distributions of laser COS under different thermal powers Pth when contact width W=100 μm. (a) Pth=0.5 W;(b) Pth=0.7 W; (c) Pth=0.9 W; (d) Pth=1.1 W; (e) Pth=1.3 W; (f) Pth=1.5 W
    Temperature distribution of active region along slow axis under different thermal powers Pth
    Maximum temperature at center of chip under different contact widths W
    Thermal resistance of laser COS under different contact widths W
    Variation in chip temperature with contact width W. (a) W=100 μm; (b) W=200 μm; (c) W=300 μm; (d) W=400 μm; (e) W=500 μm
    Temperature distribution of active region along slow axi sunder different contact widths W
    Structures of edge adiabatic package and normal package. (a) Top view of edge adiabatic package structure; (b) side view of edge adiabatic package structure; (c) side view of normal package structure
    COS experimental diagram of edge adiabatic package
    Variations in parameters related to beam quality with current for edge adiabatic package and normal package. (a) Slow axis divergence angle; (b) BPP; (c) M2
    Slow axis divergence angle versus contact width W
    Thermal resistance Rth of laser under different contact widths W
    • Table 1. Related material parameters of ANSYS 18.0

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      Table 1. Related material parameters of ANSYS 18.0

      IndexMaterialSize /(μm×μm×μm)k /(W·cm-1·K-1)
      ChipGaAs/AlxGa1-xAs500×900×1.20.55
      Heat sourceGaAs/AlxGa1-xAs100×900×0.10.55
      Solder layerIn200×900×100.82
      Transition heat sinkBeO4000×4500×1002.60
    • Table 2. Comparison of photoelectric characteristics of edge adiabatic packages and normal package devices

      View table

      Table 2. Comparison of photoelectric characteristics of edge adiabatic packages and normal package devices

      Contact widthW /μmThreshold currentIth /AElectro-opticalconversionefficiency η /%
      2000.1860
      5000.1763
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    Biyao Zhao, Hongqi Jing, Li Zhong, Yuxuan Man, Xuefeng Ban, Suping Liu, Xiaoyu Ma. Improving Slow-Axis Laser Beam Quality of Semiconductor Laser with Edge Adiabatic Package[J]. Chinese Journal of Lasers, 2020, 47(1): 0105002

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    Paper Information

    Category: beam transmission and control

    Received: Jun. 26, 2019

    Accepted: Sep. 26, 2019

    Published Online: Jan. 9, 2020

    The Author Email: Hongqi Jing (jinghq@semi.ac.cn)

    DOI:10.3788/CJL202047.0105002

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