Effect of Thermal Deformation on Imaging Performance for 16 nm Extreme Ultraviolet Lithography Objective

Yanqiu Li; Yan Liu; Lihui Liu

doi:10.3788/AOS201939.0122001

Acta Optica Sinica, Volume. 39, Issue 1, 0122001(2019)

Effect of Thermal Deformation on Imaging Performance for 16 nm Extreme Ultraviolet Lithography Objective

Yanqiu Li^1、*, Yan Liu², and Lihui Liu¹

¹ Key Laboratory of Photoelectronic Imaging Technology and System, Ministry of Education, School of Optoelectronics, Beijing Institute of Technology, Beijing 100081, China

² Beijing Aerospace Institute for Metrology and Measurement Technology, Beijing 100076, China

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Yanqiu Li, Yan Liu, Lihui Liu. Effect of Thermal Deformation on Imaging Performance for 16 nm Extreme Ultraviolet Lithography Objective[J]. Acta Optica Sinica, 2019, 39(1): 0122001

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Paper Information

Category: Optical Design and Fabrication

Received: Jul. 11, 2018

Accepted: Sep. 5, 2018

Published Online: May. 10, 2019

The Author Email:

DOI:10.3788/AOS201939.0122001

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