Optimization of Laser Spike Annealing Scanning Trajectory and Temperature Control Parameters

Shaowei Zhan; Tian Zhou; Sen Lu; Kaiming Yang; Yu Zhu; Jiong Zhou

doi:10.3788/CJL241412

Chinese Journal of Lasers, Volume. 52, Issue 8, 0802402(2025)

Optimization of Laser Spike Annealing Scanning Trajectory and Temperature Control Parameters

Shaowei Zhan^1,2, Tian Zhou^1,2, Sen Lu^1,2, Kaiming Yang^1、*, Yu Zhu^1,2, and Jiong Zhou³

Author Affiliations

¹Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

²National Key Laboratory of Science and Technology on Interface Science and Engineering for Advanced Equipment, Tsinghua University, Beijing 100084, China

³Beijing U-Precision Tech Co., Ltd., Beijing100176, China

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References(19)

[1] Zeng Z N. Generation of ultrafast extreme ultraviolet light source and its applications in semiconductor detection (invited)[J]. Acta Optica Sinica, 44, 1732007(2024).

[2] Shahidi G G. Chip power scaling in recent CMOS technology nodes[J]. IEEE Access, 7, 851-856(2019).

[3] Feng E H, Chen R, Di S X et al. Effect of heat treatment on microstructure and mechanical properties of TC4 alloy by selective laser melting[J]. Chinese Journal of Lasers, 51, 1002321(2024).

[4] Shima A, Wang Y, Talwar S et al. Ultra-shallow junction formation by non-melt laser spike annealing for 50-nm gate CMOS[C], 174-175(2004).

[5] Lindsay R, Pawlak B, Kittl J et al. A comparison of spike, flash, SPER and laser annealing for 45 nm CMOS[J]. MRS Online Proceedings Library, 765, 74(2003).

[6] Fortunato G, Mariucci L, Pecora A et al. Historical evolution of pulsed laser annealing for semiconductor processing[M]. Laser annealing processes in semiconductor technology, 1-48(2021).

[7] Yun W, Chen S Y, Shen M et al. Laser spike annealing and its application to leading-edge logic devices[C], 57-63(2008).

[8] Hea Y G, Wu B, Yu G B et al. Process match between DSA and LSA for ultra-shallow junction formation[C], 77-80(2012).

[9] Hsu W, Wen F, Wang X R et al. Laser spike annealing for shallow junctions in Ge CMOS[J]. IEEE Transactions on Electron Devices, 64, 346-352(2017).

[10] Murakoshi A, Harada T, Miyano K et al. Reduction in number of crystal defects in a p+Si diffusion layer by germanium and boron cryogenic implantation combined with sub-melt laser spike annealing[J]. Japanese Journal of Applied Physics, 56, 095503(2017).

[11] Huang H, Hu H L, Zhu J G et al. Inkjet-printed In‒Ga‒Zn oxide thin-film transistors with laser spike annealing[J]. Journal of Electronic Materials, 46, 4497-4502(2017).

[12] Ma G Y, Yu T. Laser spike annealing and SiGe dummy pattern layout study to improve contact misalignment overlay issue[C], 12-13(2017).

[13] Wendt K, Newby J. The use of cross-section haze measurements to monitor laser spike anneal (LSA) stage alignment[C], 10-12(2021).

[14] Gui Y, Jiang L, Shen Y T et al. A novel methodology to monitor wafer placement shift in laser spike anneal[C](2020).

[15] Shetty S, Jain A, Owen D M et al. Impact of laser spike annealing dwell time on wafer stress and photolithography overlay errors[C], 119-122(2009).

[16] Florakis A, Verrelli E, Giubertoni D et al. Non-melting annealing of silicon by CO2 laser[J]. Thin Solid Films, 518, 2551-2554(2010).

[17] Born M, Wolf E[M]. Principles of optics: electromagnetic theory of propagation, interference and diffraction of light, 334(1999).

[18] Chandler-Horowitz D, Amirtharaj P M. High-accuracy, midinfrared (450 cm-1≤ω≤4000 cm-1) refractive index values of silicon[J]. Journal of Applied Physics, 97, 123526(2005).

[19] Wei C Y, Wang Q, Hou H L. Simulation and experimental study of doping properties of a silicon wafer using optical cavity ring-down measurement method[J]. Laser & Optoelectronics Progress, 60, 0112005(2023).

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Shaowei Zhan, Tian Zhou, Sen Lu, Kaiming Yang, Yu Zhu, Jiong Zhou. Optimization of Laser Spike Annealing Scanning Trajectory and Temperature Control Parameters[J]. Chinese Journal of Lasers, 2025, 52(8): 0802402

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Paper Information

Category: Laser Micro-Nano Manufacturing

Received: Dec. 3, 2024

Accepted: Jan. 16, 2025

Published Online: Apr. 7, 2025

The Author Email: Kaiming Yang (yangkm@tsinghua.edu.cn)

DOI:10.3788/CJL241412

CSTR:32183.14.CJL241412

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology