Fig. 1. Manufacting of copper microelectrodes. (a) Diagram of coating preparation and laser scanning; (b) digital photo of copper ion coating surface topography; (c) schematic of laser direct writing system; (d) digital photo of copper electrode after cleaning

Fig. 2. Copper electrode wire width and sheet resistance versus incident laser power. (a) Wire width; (b) sheet resistance

Fig. 3. Copper electrode sheet resistance versus scanning speed

Fig. 4. XRD patterns of copper electrodes prepared under different laser powers

Fig. 5. SEM images of copper electrodes obtained under different laser powers (illustrations are high-resolution SEM images). (a) 456 mW; (b) 640 mW; (c) 880 mW; (d) 1580 mW