Opto-Electronic Advances, Volume. 8, Issue 2, 250017(2025)

Integrated laser processing platform based on metasurface

Mingbo Pu1,2,3、*
Author Affiliations
  • 1National Key Laboratory of Optical Field Manipulation Science and Technology, Chinese Academy of Sciences, Chengdu 610209, China
  • 2College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China
  • 3Research Center on Vector Optical Fields, Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, China
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    Figures & Tables(2)
    Design concept of M-TPP. (a) Schematic diagram of traditional multi-focus TPP system. (b) Schematic diagram of M-TPP system. (c) Printing process of an array of 3D micro/nanostructures using an MFM. (d) Contrast diagram of the conventional objective lens and the MFM. Figure reproduced from ref.17, John Wiley and Sons.
    DLW lithography and laser cutting using metalenses. (a) Schematic of the DLW lithography system. (b) Grating patterns produced by DLW with the FZL and the SCLs. (c) Schematic of the thermal drift effects of the SiC metalens (left) and the traditional objective lens (right). (d) Cross-sectional images of 4H-SiC substrates after 60 minutes of laser cutting with a 15 W, 1030 nm laser. Figure reproduced from (a, b) ref.18, under the terms of the Creative Commons CC BY license; (c,d) ref.19, John Wiley and Sons.
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    Mingbo Pu. Integrated laser processing platform based on metasurface[J]. Opto-Electronic Advances, 2025, 8(2): 250017

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    Paper Information

    Category: Research Articles

    Received: Feb. 5, 2025

    Accepted: Feb. 10, 2025

    Published Online: Apr. 27, 2025

    The Author Email: Mingbo Pu (MBPu)

    DOI:10.29026/oea.2025.250017

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