Laser & Optoelectronics Progress, Volume. 58, Issue 7, 0723001(2021)
Simulation and Analysis of Light Extraction Efficiency of GaN-Based Flip Chip with Sidewall Roughness
Fig. 3. Process diagram of laser hidden cutting dot. (a) Sapphire side wall after laser hidden cutting; (b) hidden tangent point model; (c) cross-section model of hidden tangent points
Fig. 8. Variation curves of LEE with number of hidden cutting layers in empty space
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Xue Wang, Zhiyong Cui, Bing Wang, Kai Guo, Ruifei Duan, Yiping Zeng, Jinmin Li. Simulation and Analysis of Light Extraction Efficiency of GaN-Based Flip Chip with Sidewall Roughness[J]. Laser & Optoelectronics Progress, 2021, 58(7): 0723001
Category: Optical Devices
Received: Jul. 3, 2020
Accepted: Aug. 28, 2020
Published Online: Apr. 25, 2021
The Author Email: Xue Wang (wangxue@luan-uv.com), Yiping Zeng (zengyiping@htmocvd.com)