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Zhang Jieyuan, Hu Yanlei, Wang Fangcheng, Liu Qiang, Niu Fangfang, Li Jinhui, Huang Mingqi, Zhang Guoping, Sun Rong. Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips[J]. International Journal of Extreme Manufacturing, 2025, 7(1): 15005