Fig. 1. Schematic diagrams of finite element model and arrangement of feature points. (a) Model meshing; (b) arrangement of feature points

Fig. 2. Temperature distributions at different time

Fig. 3. Node temperature varying with time when transition mode is from 100%TC4 to 100%TC11

Fig. 4. Distributions of Mises stress after cooling to room temperature and residual stress of each direction. (a) Mises stress; (b) stress along scanning direction; (c) stress along overlapping direction; (d) stress along deposition direction

Fig. 5. Stress varying with time of feature points along scanning direction

Fig. 6. Residual stress distribution curves of feature points at interface under different transition modes

Fig. 7. Relationship between average residual stress and TC11 content at interface under different transition modes