[1] [1] Knig H, Grnninger G, Brick P, et al. Brilliant high power laser bars for industrial applications［C］. Proc SPIE, 2008, 6876: 687616.

[2] [2] Lichtenstein N, Krejci M, Manz Y, et al. Recent developments for BAR and BASE: setting the trends［C］. Proc SPIE, 2008. 6876: 68760c.

[3] [3] Ma Xiaoyu, Wang Jun, Liu Suping. Present situation of investigations and applications in high power semiconductor lasers［J］. Infrared and Laser Engineering, 2008, 32(2): 189-194.

[4] [4] Li Jiang, Li Chao, Xu Hao, et al. Thermal analysis of high power semiconductor laser bar［J］. Chinese Journal of Luminescence, 2014, 35(12): 1474-1479.

[5] [5] Beach R, Benett W J, Freitas B L, et al. Modular microchannel cooled heatsinks for high average power laser diode arrays［J］. IEEE Journal of Quantum Electronics, 1992, 28(4): 966-976.

[6] [6] Tsunekane M, Taira T. Design and performance of compact heatsink for high-power diode edge-pumped, microchip lasers［J］. IEEE Journal of Selected Topics in Quantum Electronics, 2007, 13(3): 619-625.

[7] [7] Yilmaz A, Büyükalaca O, Yilmaz T. Optimum shape and dimensions of ducts for convective heat transfer in laminar flow at constant wall temperature［J］. International Journal of Heat and Mass Transfer, 2000, 43(5): 767-775.

[8] [8] Muzychka Y S, Yovanovich M M. Laminar forced convection heat transfer in the combined entry region of non-circular ducts［J］. Journal of Heat Transfer, 2004, 126(1): 54-61.

[9] [9] Bergles A E. Heat transfer enhancement-the encouragement and accommodation of high heat fluxes［J］. Journal of Heat Transfer,1997,119(2): 8-19.

[10] [10] Tao W.Q, He Y L, Wang Q.W, et al. A unified analysis on enhancing single phase convective heat transfer with fields synergy principle［J］. International Journal of Heat and Mass Transfer, 2002, 45(24): 4871-4879.

[11] [11] Bejan A, Sciubba E. The optimal spacing of parallel plates cooled by forced convection［J］. International Journal of Heat and Mass Transfer, 1992, 35(12): 3259-3264.

[12] [12] Wang Yuanyuan, Sun Na, Chang Huizeng, et al. Research on the design and fabrication technology of the compound micro-channl heat sink［J］. Processing, Measurement and Equipment, 2012, 49(10): 687-692.

[13] [13] Lü Wenqiang,Tu Bo,Wei Bin, et al. Micro-channel heat sink module for high power diode laser［J］. High Power Laser & Particle Beams, 2005, 17(20): 83-86.

[14] [14] Vafai K, Zhu L. Analysis of two-layered micro-channel heat sink concept in electronic cooling［J］. International Journal of Heat and Mass Transfer, 1999, 42(12): 2287-2297.

[15] [15] Jandeleit J, Wiedmann N. Reliability and degradation mechanisms of high power diode lasers［C］. Proc SPIE, 1999, 3626: 217-221.

[16] [16] Versteeg H K, Malalasekera W. An introduction to computational fluid dynamics［M］. NewYork: The Finite Volume Method,1995: 5-6.

[17] [17] Bogojevic D, Sefiane K, Walton A J, et al. Investigation of flow distribution in microchannels heat sinks［J］. Heat Transfer Engineering, 2009, 30(13): 1049-1057.

[18] [18] Yao Shun, Ding Peng, Liu Jiang, et al. Microchannel heat sink of high beam quality semiconduetor laser array［J］. Chinese J Lasers, 2009, 36(9): 2286-2289.

[19] [19] Merritt S A, Heim P J S, Cho S H, et al. Controlled solder interdiffusion for high power semiconductor laser diode die bonding［J］. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1997, 20(2): 141-145.