Fig. 1. Optical path diagram of high speed trajectory controlled beam scanning processing

Fig. 2. Schematic diagram of combined angle of deflection wedge. (a) Relative deflection angle is 0°; (b) relative deflection angle is 180°; (c) relative deflection angle is 360°

Fig. 3. Schematic diagram of offset of parallel plate group. (a) Minimum offset state; (b) maximum offset state

Fig. 4. Schematic diagram of different hole types processed by femtosecond laser. (a) Cylindrical hole; (b) positive taper hole; (c) inverted taper hole

Fig. 5. Schematic diagram of cylindrical hole deep hole processing

Fig. 6. Nozzle hole processing effect. (a) Profile of nozzle; (b) enlarged view of nozzle outlet; (c) enlarged view of nozzle inlet

Fig. 7. Micro-hole with a diameter of 25 μm. (a) Front of micro-hole; (b) back of micro-hole

Fig. 8. Taper hole processing effect. (a) Front side of the -5° inverted taper hole; (b) reverse side of the -5° inverted taper hole; (c) front side of the +5° positive taper hole; (d) reverse side of the +5° positive taper hole

Fig. 9. Sectional view of inverted taper hole with a taper of -5°

Fig. 10. Sectional view of micro-hole with aspect ratio of 20∶1