[1] [1] Kumar N, Kennedy K, Gildersleeve K, et al. A review of yield modelling techniques for semiconductor manufacturing［J］. International Journal of Production Research, 2006, 44（23）：5019-5036.

[2] [2] Quirk M, Serda J. Semiconductor manufacturing technology［M］. Upper Saddle River, NJ：Prentice Hall, 2001.

[3] [3] Shankar N G, Zhong Z W. Defect detection on semiconductor wafer surfaces［J］. Microelectronic Engineering, 2005, 77（3-4）：337-346.

[4] [4] Oatley C W. The early history of the scanning electron microscope［J］. Journal of Applied Physics, 1982, 53（2）：R1-R13.

[5] [5] Stokowski S, Vaez-Iravani M. Wafer inspection technology challenges for ULSI manufacturing［C］//AIP Conference Proceedings. IOP Institute of Physics Publishing Ltd., 1998：405-418.

[6] [6] Yu F, Xu M, Wang J, et al. Balancing the efficiency and sensitivity of defect inspection of non-patterned wafers with TDI-Based dark-field scattering microscopy［J］. Sensors, 2024, 24（5）：1622.

[8] [8] Liu C, Xu S, Liu Y, et al. Aperture design for a dark-field wafer defect inspection system［J］. Applied Optics, 2021, 60（35）：10830-10837.

[9] [9] Kaempf U. The binomial test：A simple tool to identify process problems［J］. IEEE Transactions on semiconductor manufacturing, 1995, 8（2）：160-166.

[10] [10] Luebbers R, Steich D, Kunz K. FDTD calculation of scattering from frequency-dependent materials［J］. IEEE Transactions on Antennas and Propagation, 1993, 41（9）：1249-1257.

[11] [11] Young A T. Rayleigh scattering［J］. Applied Optics, 1981, 20（4）：533-535.

[12] [12] Mie G. Beitrge zur Optik trber Medien, speziell kolloidaler Metallsungen［J］. Annalen der Physik, 1908, 330（3）：377-445.

[13] [13] Yee K S, Chen J S. The finite-difference time-domain（FDTD）and the finite-volume time-domain（FVTD）methods in solving Maxwell's equations［J］. IEEE Transactions on Antennas and Propagation, 1997, 45（3）：354-363.

[14] [14] Liu Z, Wu J, Zhang Y, et al. Optical trapping and axial shifting for strongly absorbing particle with single focused TEM00 Gaussian beam［J］. Applied Physics Letters, 2018, 113（9）：091101.

[15] [15] Wolters C, Reich J. Surface scanning inspection system with independently adjustable scan pitch：U.S. Patent 9, 116, 132［P］. 2015-8-25.