Chinese Optics Letters, Volume. 19, Issue 4, 041402(2021)

Combined studies of surface evolution and crack healing for the suppression of negative factors during CO2 laser repairing of fused silica

Chao Tan1, Linjie Zhao1, Mingjun Chen1、*, Jian Cheng1、**, Zhaoyang Yin1, Qi Liu1, Hao Yang1, and Wei Liao2
Author Affiliations
  • 1State Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin 150001, China
  • 2Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China
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    Figures & Tables(6)
    Schematic diagram of the non-evaporative laser repairing of fused silica surface damage. (a) CO2 laser repairing schematic; (b) original surface damage pit.
    Surface morphology evolutions and phase transition processes of fused silica optics irradiated by CO2 lasers with different powers. (a), (c), (e) represent the heating stage at the laser action time of 5 s; (b), (d), (f) are the cases when cooling is for 0.1 s. In the pseudo-color scale, one represents the liquid phase, while zero represents the solid phase.
    CO2 laser repairing experiments of different laser powers and corresponding calculated morphologies under the same condition.
    Evolution process of crack morphology under laser action.
    Size of the residual air layer inside the crack irradiated by the laser of different powers.
    Repairing results of two processing schemes. (a) and (d) are the initial surface damage morphologies; (b) and (c) are the repairing results of scheme I; (e) and (f) are the repairing results of scheme II.
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    Chao Tan, Linjie Zhao, Mingjun Chen, Jian Cheng, Zhaoyang Yin, Qi Liu, Hao Yang, Wei Liao, "Combined studies of surface evolution and crack healing for the suppression of negative factors during CO2 laser repairing of fused silica," Chin. Opt. Lett. 19, 041402 (2021)

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    Paper Information

    Category: Lasers, Optical Amplifiers, and Laser Optics

    Received: Aug. 20, 2020

    Accepted: Oct. 9, 2020

    Published Online: Jan. 8, 2021

    The Author Email: Mingjun Chen (chenmj@hit.edu.cn), Jian Cheng (cheng.826@hit.edu.cn)

    DOI:10.3788/COL202119.041402

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