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Piezoelectrics & Acoustooptics, Volume. 42, Issue 2, 193(2020)

Analysis of “Misalignment” in Laser Welding for Hemispherical Gyroscope Packaging

LI Zhi, JIANG Chunqiao, HE Haiping, PENG Kai, and CHEN Wei
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    [1] [1] CHENG W H，WANG W H,CHEN J C.Defect formation mechanisms in laser welding techniques for semiconductor laser packaging［J］. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B,1996,19(4):764 769.

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    LI Zhi, JIANG Chunqiao, HE Haiping, PENG Kai, CHEN Wei. Analysis of “Misalignment” in Laser Welding for Hemispherical Gyroscope Packaging[J]. Piezoelectrics & Acoustooptics, 2020, 42(2): 193

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    Paper Information

    Received: Nov. 4, 2019

    Accepted: --

    Published Online: Apr. 21, 2022

    The Author Email:

    DOI:10-11977/j.issn.1004-2474.2020-02-011

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology