[1] [1] XING X W. Common heat dissipation ways and practice of power electronic devices [J]. Electronic Technology & Software Engineering, 2018(19): 237. (in Chinese)

[2] [2] GAO M Y, LIU J, ZHU D J. Research on heat dissipation technology of notebook [J]. Internal Combustion Engine & Parts, 2018(13): 223-224. (in Chinese)

[3] [3] WANG C Q, WANG D, ZHAN N Y. Summarize about the research on energy saving of small electronic device heat dissipation [J]. Journal of Jilin Jianzhu University, 2016, 33(1): 51-54. (in Chinese)

[4] [4] YANG L, MIAO L, DI L P. Research on air cooling technology of high power electronic equipment [J]. Mechanical Engineer, 2012(8): 60-62. (in Chinese)

[5] [5] CHEN G Q, ZHU M B. Thermal test and numerical simulation on heat transfer characteristics of forced air cooling for electronic equipment [J]. Computer Aided Engineering, 2018, 17(2): 24-26. (in Chinese)

[6] [6] CUI D, HAN R, MA Q, et al. Thermal analysis and application of 5 in automotive high luminance module [J]. Chinese Journal of Liquid Crystals and Displays, 2017, 32(10): 765-771. (in Chinese)

[7] [7] LI Y Z. Effect of water cooling system on the computer chassis [J]. Value Engineering, 2018, 37(12): 191-193. (in Chinese)

[8] [8] QIAN J F, ZHANG Y, HONG X, et al. Study on one type of laptop computer water cooling device [J]. Refrigeration & Air Conditioning, 2014, 28(5): 593-597. (in Chinese)

[9] [9] KOU Z H, WANG Y D, LIU C X, et al. Experimental and numerical investigation on thermal performance of a flat heat pipe radiator with micro-grooves [J]. Cryogenics & Superconductivity, 2018, 46(12): 44-48. (in Chinese)

[10] [10] MOON S H, PARK Y W, RHI S H. The carbon wire bundle’s constructing as a capillary wick in the flat thin heat pipe [J]. Applied Thermal Engineering, 2017, 126: 1177-1184.

[11] [11] YANG Y, WEI X, XIE X Z, et al. Theoretical modeling and experimental investigation on flat heat pipe with a composite－grooved wick structure [J]. Cryogenics & Superconductivity, 2018, 46(2): 56-60, 85. (in Chinese)

[12] [12] BRENN G, HELPI T, DURST F. A new apparatus for the production of monodisperse sprays at high flow rates [J]. Chemical Engineering Science, 1997, 52(2): 237-244.

[13] [13] LIU C G, ZHOU Z Y, WANG X H, et al. The characteristics of a piezoelectrically actuated micro jet [J]. Piezoelectrics & Acoustooptics, 2001, 23(4): 272-274. (in Chinese)

[14] [14] SELVAM R P, SARKAR M, SARKAR S, et al. Modeling thermal-boundary-layer effect on liquid-vapor interface dynamics in spray cooling [J]. Journal of Thermophysics and Heat Transfer, 2009, 23(2): 356-370.

[15] [15] CAI Y F. The principle and cooling application of the atomizer with vibrating micro tapered apertures[D]. Nanjing: Nanjing University of Aeronautics and Astronautics, 2016. (in Chinese)