Low-dielectric-constant (Low-K) materials are widely utilized in chip fabrication owing to their ability to enhance overall device performance by reducing the parasitic capacitance and signal delay. However, the porous and mechanically fragile nature of Low-K materials often results in edge chipping, micro-cracking, and delamination during wafer dicing processes. This study systematically investigated the influence of various laser grooving parameters on edge quality and groove geometry in Low-K chip dicing. Subsequently, the chips obtained under different laser grooving parameters are packaged and tested for reliability. Key findings demonstrate that laser grooving parameters significantly affect dicing morphology and result in different stresses in the reliability test after packaging, thus affecting the reliability of the circuit.