Avoiding silicon/glass bonding damage with fusion bonding method

Chinese Optics Letters, Volume. 2, Issue 9, 09541(2004)

Daohong Yang^1,2、*, Chen Xu^1,2, and Guangdi Shen^1,2

Author Affiliations

¹College of Electronic Information &

²Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022

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References(6)

[1] [1] T. Rogers and J. Kowal, Sensors and Actuators A 46, 113 (1995).

[2] [2] E. T. Enikov and J. G. Boyd, International J. Engineering Science 38, 135 (2000).

[3] [3] X. Chauffleur, G. Blasquez, and P. Pons, Sensors and Actuators A 46, 121 (1995).

[4] [4] G. Blasquez and P. Favaro, Sensors and Actuators A 101, 156 (2002).

[5] [5] J.-T. Huang and H.-A. Yang, Sensors and Actuators A 102, 1 (2002).

[6] [6] U. M. Mescheder, M. Alavi, and K. Hiltmann, Sensors and Actuators A 97, 422 (2002).

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Daohong Yang, Chen Xu, Guangdi Shen, "Avoiding silicon/glass bonding damage with fusion bonding method," Chin. Opt. Lett. 2, 09541 (2004)

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Paper Information

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Received: Mar. 15, 2004

Accepted: --

Published Online: Jun. 6, 2006

The Author Email: Daohong Yang (daohongyang@emails.bjpu.edu.cn)

DOI:

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