Chinese Journal of Lasers, Volume. 48, Issue 8, 0802013(2021)

Research Progresses of Process Technology in Ultrafast Laser Micro-Hole Drilling

Zhanwen A1,2, Ying Wu1, Yu Xiao1, Ruikun Geng1, and Guisheng Zou1、*
Author Affiliations
  • 1Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
  • 2School of Mechanical Engineering, Qinghai University, Xining, Qinghai 810016, China
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    Figures & Tables(10)
    Effects of pulse energy on breakthrough time and maximum aspect ratio[13-14]. (a) Effect on breakthrough time[13]; (b) effect on maximum-aspect ratio[14]
    Shadowgraphs taken at 6 ns after 1st, 250th, 500th, 1000th, and 2000th pulses with different pulse widths[16]
    Variation of rim height, size of oxidized area and average drilling rate in dependence on pulse repetition rate for fixed pulse energy (E = 0.23 mJ)[18]
    Effect of polarization on laser beam traveling in the hole[22]. (a) Reflections inside the deep hole with an angle of incidence of 85°; (b) azimuth angle varies with the change of positions; (c) entrance and exit of drilled holes using respective a linearly and circularly polarized beam; (d) cross-section of drilled hole under linear polarization with pulse energy of 0.5 mJ; (e) cross-section of drilled hole under linear polarization with pulse energy of 2 mJ (the rectangular zone enclosed by dotted line represents the polarization removal)
    Two typical helical drilling systems[37]. (a) Helical drilling base on three wedge plates; (b) helical drilling base on Dove prism
    Surface morphology of the entrance and exit ends[38]
    Cross-section of micro-holes machined with different scanning paths[39]. (a) Circular scanning; (b) linear scanning; (c) linear+circular scanning
    Schematic of different auxiliary processing methods. (a) Auxiliary processing with vacuum environment[14]; (b) auxiliary processing with heat[15]; (c) auxiliary processing with water [42]; (d) auxiliary processing with electric[43]
    • Table 1. Main materials and typical applications of ultrafast laser micro-hole drilling

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      Table 1. Main materials and typical applications of ultrafast laser micro-hole drilling

      TypeMaterialTypical application
      MetalsSuperalloy and stainless steelAerospace and automobile industry
      CeramicsAlumina, silicon carbide,and zirconiaAerospace industry
      GlassesFused silicaTelecommunication and medicine
      PolymersPolyimide (PI) and polymethyl methacrylate (PMMA)Microelectronics circuits and microfluidic devices
      CompositesSiC/SiC compositesAerospace industry
    • Table 2. Influence of main process parameters on ultrafast laser micro-hole drilling

      View table

      Table 2. Influence of main process parameters on ultrafast laser micro-hole drilling

      ParameterInfluence
      Pulse energyAdvantages: drilling rate and diameter increase with higher pulse energy, except for stainless steel due to plasma shieldDisadvantages: easy to induce damages with higher pulse energy
      FrequencyAdvantages: drilling rate increases with higher frequencyDisadvantages: easy to induce heat effected zone and the micro-hole tends to bend in the bottom with higher frequency
      ParameterInfluence
      Pulse widthAdvantages: drilling rate increases with shorter pulse width, except for stainless steel due to air ionizationDisadvantages: easy to induce damages with shorter pulse width
      WavelengthThe hole shape is different and green light has more advantages in hole depth and sidewall quality than infrared light
      PolarizationLinearly polarization leads to non-circular hole shapesRotate the polarization direction to avoid this problem (circularly polarization is also advised due to its simplicity)
      Beam profileCompare with top hat beam profile, the Gaussian beam is more easy to induce heat-affected zone, and the hole entrance is funnel-shaped
      Auxiliary methodGas(usually nitrogen or air): increase the heat conductivity and blow the debris away therefore leads to small heat-affected zone and clean surface Vacuum: avoid bending of holesWater and ultrasonic: clean surface and thinner recast layersHeat and electric: hole diameter increases but more debris on the surface
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    Zhanwen A, Ying Wu, Yu Xiao, Ruikun Geng, Guisheng Zou. Research Progresses of Process Technology in Ultrafast Laser Micro-Hole Drilling[J]. Chinese Journal of Lasers, 2021, 48(8): 0802013

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    Paper Information

    Category: laser manufacturing

    Received: Nov. 30, 2020

    Accepted: Jan. 11, 2021

    Published Online: Apr. 13, 2021

    The Author Email: Zou Guisheng (zougsh@tsinghua.edu.cn)

    DOI:10.3788/CJL202148.0802013

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