Laser & Optoelectronics Progress, Volume. 61, Issue 23, 2300005(2024)
Research and Development Prospects of Laser Shock Peening as a Post-Processing Technique for Selective Laser Melting
Fig. 3. Residual stress distribution near the hole at laser power densities of 4.7 GW/cm² and 6.6 GW/cm²[14]. (a) Contour map of residual stress distribution; (b) residual stress distribution along the AB line
Fig. 5. Impact test results[19]. (a) Average grain size of each sample; (b) cross-sectional microhardness distribution curves for each sample
Fig. 6. Cross-sectional grain morphology of the original sample[21]. (a) Semi-circular melt pool boundary; (b) refined morphology in the blue dashed-line region; (c) pores
Fig. 7. Cross-sectional grain morphology of LSP-ed sample[21]. (a) Deformed layer; (b) refined microstructure within the blue dashed-line frame; (c) microhardness of the original and LSP-ed samples
Fig. 8. Fatigue crack initiation and fatigue crack growth in LSP-treated Ti6Al4V titanium alloy[30]. (a) Crack length variation with cycle numbers at different laser shock intensities; (b)values of C and m for different sets of materials derived from the Paris equation fitting; (c)‒(f) functional relationship between FCG rate and crack length, as well as the relationship between FCG rate and ΔK; (g) (h) enlarged images of localized regions
Fig. 10. Influence of different processing methods on sample cracks[33]. (a) Macroscopic appearance of the fracture surface of high-temperature specimens; (b) unmelted powder with stress of 400 MPa and 8.29×104 cycles; (c) regions exhibiting incomplete fusion with stress of 340 MPa and 2.78×105 cycles; (d) clusters of α-phase with stress of 280 MPa and 5.52×108 cycles; (e) stress of 370 MPa and 3.57×107 cycles
Fig. 11. Comparative charts before and after using LSPwC[43]. (a) Sa; (c) Ra; (b)(d) surface roughness profile
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Xinjie Dai, Jianlei Wang, Yunxia Ye, Chuanqi Huang, Jiasheng Guo, Weiqiang Yang, Yaobin Qu. Research and Development Prospects of Laser Shock Peening as a Post-Processing Technique for Selective Laser Melting[J]. Laser & Optoelectronics Progress, 2024, 61(23): 2300005
Category: Reviews
Received: Feb. 5, 2024
Accepted: Apr. 14, 2024
Published Online: Nov. 26, 2024
The Author Email: Chuanqi Huang (hcq960512@163.com)
CSTR:32186.14.LOP240663