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Semiconductor Optoelectronics, Volume. 46, Issue 2, 293(2025)

Experimental Study on Laser-Electrochemical Hybrid Machining of Through-Slots in Silicon Wafers

MAO Dongchen, ZHANG Wenjie, ZHAO Kangcheng, and ZHU Hao
Author Affiliations
  • School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, CHN
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    MAO Dongchen, ZHANG Wenjie, ZHAO Kangcheng, ZHU Hao. Experimental Study on Laser-Electrochemical Hybrid Machining of Through-Slots in Silicon Wafers[J]. Semiconductor Optoelectronics, 2025, 46(2): 293

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    Received: Mar. 11, 2025

    Accepted: Sep. 18, 2025

    Published Online: Sep. 18, 2025

    The Author Email:

    DOI:10.16818/j.issn1001-5868.20250311002

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology