Fig. 1. Schematic diagram of OLED devices failure process induced by external factors.（a）Water vapor intrudes into the interior of the device；（b）Electrolysis of water vapor produces gas，causing bulges of the electrodes；（c）No electrons can flow through the bulged area，resulting in black spots.

Fig. 2. Schematic diagram of encapsulation layer WVTR requirements for OLED devices，TFT devices and LCD devices.

Fig. 3. Schematic diagram of（a）damseal encapsulation structure，（b）faceseal encapsulation structure and（c）thin film encapsulation structure.

Fig. 4. Examples of bent and curled OLED displays for automotive applications

Fig. 5. Schematic diagram of water/oxygen invasion path in a three-layer film encapsulation

Fig. 6. （a）Schematic diagram of cracks generated by OLED surface foreign matter in the silicon barrier film prepared by PECVD；（b）Schematic diagram of the cracks in the silicon-based barrier film covered by the oxide film prepared by ALD.

Fig. 7. （a）Schematic diagram of aluminate phase formed at the interface of SiO₂ polymer and Al₂O₃；（b）Schematic diagram of the silicification reaction at the interface.

Fig. 8. （a）Structure diagram of DMD in the first inorganic barrier layer；（b）Diagram of different DMD structures for comparison；（c）Comparison chart of heat dissipation capabilities of different DMD structures；（d）Comparison chart of barrier performance of different DMD structures.