Journal of Inorganic Materials, Volume. 37, Issue 9, 947(2022)

Mechanical Properties and Thermal Conductivity of Si3N4 Ceramics with Composite Sintering Additives

Shi FU1,2, Zengchao YANG1, Honghua LI1、*, Liang WANG1, and Jiangtao LI1,2、*
Author Affiliations
  • 11. Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Science, Beijing 100190, China
  • 22. Center of Materials Science and Optoelectronics Engineering, University of the Chinese Academy of Science, Beijing 100049, China
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    References(23)

    [1] CHOI U M, BLAABJERG F, JORGENSEN S et al. Power cycling test and failure analysis of molded intelligent power IGBT module under different temperature swing durations[J]. Microelectronics Reliability, 403-408(2016).

    [4] HAGGERTY J S, LIGHTFOOT A. Opportunities for enhancing the thermal conductivities of SiC and Si3N4 ceramics through improved processing[J]. Ceramic Engineering and Science Proceeding, 475-487(1995).

    [6] KITAYAMA M[J], 165-181(2021).

    [11] LI Y, KIM H-N, WU H et al. Microstructure and thermal conductivity of gas-pressure-sintered Si3N4 ceramic: the effects of Y2O3 additive content[J]. Journal of the European Ceramic Society, 274-283(2021).

    [22] WATARI K. High thermal conductivity non-oxide ceramics[J]. Journal of the Ceramic Society of Japan(2001).

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    Shi FU, Zengchao YANG, Honghua LI, Liang WANG, Jiangtao LI. Mechanical Properties and Thermal Conductivity of Si3N4 Ceramics with Composite Sintering Additives [J]. Journal of Inorganic Materials, 2022, 37(9): 947

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    Paper Information

    Category: RESEARCH ARTICLE

    Received: Mar. 2, 2022

    Accepted: --

    Published Online: Jan. 12, 2023

    The Author Email: Honghua LI (lihonghua@mail.ipc.ac.cn), Jiangtao LI (lijiangtao@mail.ipc.ac.cn)

    DOI:10.15541/jim20220101

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