[1] [1] Kestenbaum Ami, Serafino Anthony J. Electrical conductor deposition method [P]. U.S. Patent, 5064685, 1991

[2] [2] A. J. Castro, R. P. van Duyne, K. C. Sheng et al.. Laser direct writing [P]. U.S. Patent, 5378508, 1995.

[3] [3] Hirofumi Hidai, Hitoshi Tokura. Drect laser writing of aluminum and copper on glass surfaces from metal powder [J]. Applied Surface Science, 2001, 174(2): 118～124

[4] [4] X. Li, H. Li, Y. Chen et al.. Silver conductor fabrication by laser direct writing on Al2O3 substrate [J]. Appl. Phys. A, 2004, 79(8): 1861～1863

[5] [5] Xiangyou Li, Xiaoyan Zeng, Huiling Li et al.. Laser direct fabrication of silver conductors on glass substrate[J]. Thin Solid Films, 2005, 483(1～2): 270～275

[6] [6] Xiangyou Li, Huiling Li, Jingwei Liu et al.. Conductive line preparation on resin surfaces by laser micro-cladding conductive pastes [J]. Applied Surface Science, 2004, 233(1～4): 51～57

[7] [7] Li Xiangyou. Research of Arts, Mechanisms and System in Conductor Fabrication by Laser Micro Cladding Electronic Pastes [D]. Wuhan: Huazhong University of Science & Technology Library, 2003. 3

[8] [8] Hao Yu, Zhang Jianjun. The package process develop trend of little consume electronic production [C]. The sixth SMT/SMD conference papers of Chinese electronic association, 288～298

[9] [9] Li Yaolin. Thick-Film Electronic Components [M]. Guangzhou: Huanan University of Science & Technology Publishing Company, 1991. 28～34