Piezoelectrics & Acoustooptics, Volume. 44, Issue 5, 696(2022)

Design Optimization of I.H.P. SAW Substrate Structure for Wideband Filter

SUN Xiaohong, ZHANG Xiaodong, and YANG Yijun
Author Affiliations
  • [in Chinese]
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    References(8)

    [1] [1] RUPPEL C C W. Acoustic wave filter technology-A review[J].IEEE Transactions on Ultrasonics,Ferroelectrics,and Frequency Control,2017,64(9):1390-1400.

    [2] [2] SU R,SHEN J,LU Z,et al.Wideband and low-loss surface acoustic wave filter based on 15°YX-LiNbO3/SiO2/Si structure[J].IEEE Electron Device Letters,2021,42(3):438-441.

    [3] [3] HASHIMOTO K,KADOTA M,NAKAO T,et al.Recent development of temperature compensated SAW devices[C]//Orlando,FL,USA:2011 IEEE International Ultrasonics Symposium,IEEE,2011:79-86.

    [4] [4] TAKAI T,IWAMOTO H,TAKAMINE Y,et al.IHP SAW technology and its application to microacoustic components[C]//Washington,DC,USA:2017 IEEE International Ultrasonics Symposium (IUS),IEEE,2017:1-8.

    [5] [5] VENTURA P,HODE J M,LOPES B.Rigorous analysis of finite SAW devices with arbitrary electrode geometries[C]//Seattle,WA,USA:1995 IEEE Ultrasonics Symposium,Proceedings,An International Symposium,IEEE,1995:257-262.

    [6] [6] WANG W B,ZHANG X D,SHUI Y A,et al.Study on the bulk wave radiation of finite-length SAW devices using FEM/BEM[J].Progress in Natural Science,2005,15(5):402-406.

    [8] [8] NAKANISHI H,NAKAMURA H,TSURUNARI T,et al.Good temperature coefficient of frequency SAW resonator on a SiO2/Al/LiNbO3 structure[C]//San Diego,CA,USA:2010 IEEE International Ultrasonics Symposium,IEEE,2010:1298-1301.

    [9] [9] MIURA M,MATSUDA T,UEDA M,et al.Temperature compensated LiTaO3/sapphire SAW substrate for high power applications[C]//Rotterdam,Netherlands:Proc.IEEE Ultrason.Symp,2005:573-576.

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    SUN Xiaohong, ZHANG Xiaodong, YANG Yijun. Design Optimization of I.H.P. SAW Substrate Structure for Wideband Filter[J]. Piezoelectrics & Acoustooptics, 2022, 44(5): 696

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    Paper Information

    Special Issue:

    Received: May. 7, 2022

    Accepted: --

    Published Online: Jan. 27, 2023

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2022.05.006

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