Acta Optica Sinica, Volume. 42, Issue 5, 0523001(2022)

Fabrication and Performance Evaluation of Flexible Polymer Waveguides for Board-Level Optical Interconnection Application

Xiaofeng Liu1,2, Guodong Wang2, Tengfei Yao2, Yongkai Li2, Lin Ma3, Hua Miao2、*, and Rong Sun1、**
Author Affiliations
  • 1Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong 518055, China
  • 2Shennan Circuits Co., Ltd., Shenzhen, Guangdong 518117, China
  • 3State Key Laboratory of Advanced Optical Communication Systems and Networks, Shanghai Jiao Tong University, Shanghai 200240, China
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    Figures & Tables(7)
    Diagrams of stress distribution on neutral plane and flexible polymer waveguide with sandwich-like structure. (a) Diagram of flexible polymer waveguide with sandwich-like structure; (b) diagram of stress distribution on neutral plane
    Illustration of fabrication process of flexible waveguides
    Results of morphology characterization. (a) Three dimensional shape of waveguide obtained by laser confocal microscope; (b) cross-section micrographs of polymer waveguide observed by optical microscope; (c) typical top view of waveguides (SEM image)
    Transmission characteristics of flexible waveguide. (a) Diagram of waveguide coupling test system; (b) insertion loss of 10.5 cm waveguide channel; (c) measured propagation loss of waveguide using truncation method; (d) test results of waveguide channel crosstalk
    Relationship among bending loss, bending radius, and channel number. (a) Relationship between bending loss and bending radius; (b) insertion loss of waveguide after 1000 times bending with bending radii of 1 mm and 3 mm
    Experimental results of waveguide reliability. (a) TG and (b) DTG curves of polymer waveguide materials at heating rate of 10 ℃·min-1 under N2; (c) temperature-time curve of reflow soldering; (d) propagation loss of waveguides obtained by environmental reliability test
    • Table 1. Elastic modulus, Poisson’s ratio, and film thickness of materials

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      Table 1. Elastic modulus, Poisson’s ratio, and film thickness of materials

      MaterialYoung’s modulus Ei /GPaPoisson’s ratio υiThickness di /μm
      PI substrate2.90.38110
      Cladding material2.20.3340 (under layer), 70 (upper layer)
      Core material2.50.3450
      Adhesive layer1.30.3250
      PI cover layer2.90.3850
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    Xiaofeng Liu, Guodong Wang, Tengfei Yao, Yongkai Li, Lin Ma, Hua Miao, Rong Sun. Fabrication and Performance Evaluation of Flexible Polymer Waveguides for Board-Level Optical Interconnection Application[J]. Acta Optica Sinica, 2022, 42(5): 0523001

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    Paper Information

    Category: Optical Devices

    Received: Aug. 2, 2021

    Accepted: Sep. 1, 2021

    Published Online: Apr. 15, 2022

    The Author Email: Miao Hua (Miaoh@scc.com.cn), Sun Rong (rong.sun@siat.ac.cn)

    DOI:10.3788/AOS202242.0523001

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