Chinese Journal of Lasers, Volume. 14, Issue 10, 635(1987)
Laser enhanced copper plating
The mechanism and experimental method for laser enhanced plating are described. With this new technique we got spots and lines of copper plated on glass substrates-. A plating rate of 0.1-lum/s and plating enhancement ratio on the order of 103 have been obtained.
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Yuan Jiayong, Li Shijie, Wang Jinghuan, Wang Maoxin, Qin Liang, Chen Qi. Laser enhanced copper plating[J]. Chinese Journal of Lasers, 1987, 14(10): 635
Paper Information
Category: laser devices and laser physics
Received: May. 29, 1986
Accepted: --
Published Online: Aug. 10, 2012
The Author Email:
CSTR:32186.14.
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