Fig. 1. Effect of impregnation times under a vacuum pressure on electrical conductivity of graphite perform and deposition rate of the plating. (a) Conductivity; (b) deposition rate

Fig. 2. Effect of impregnation times under a vacuum pressure on plating appearance and bonding conditions of the plating and the substrate. (a) Untreated; (b) once; (c) twice; (d) 3 times

Fig. 3. Different graphite preform surface states. (a) Untreated; (b) once; (c) twice; (d) 3 times

Fig. 4. Effect of plating time on deposition rate

Fig. 5. Effect of plating time on plating apparent morphology. (a) 10 min; (b) 30 min; (c) 50 min; (d) 70 min; (e) 90 min

Fig. 6. Effect of current density on deposition rate

Fig. 7. Effect of current density on plating grain. (a) 2.5×102 A·m-2; (b) 3.75×102 A·m-2; (c) 5×102 A·m-2; (d) 6.25×102 A·m-2; (e) 7.5×102 A·m-2

Fig. 8. Interfacial morphology of graphite and electroplated copper layer

Fig. 9. Copper-graphite self-lubricating composite

Fig. 10. Interface and microscopic morphology of copper-graphite self-lubricating composites