Journal of Infrared and Millimeter Waves, Volume. 41, Issue 6, 1037(2022)

Design of 220 GHz power amplifier based on 90 nm InP HEMT process

Yan CHEN1, Fan-Zhong MENG1, Yuan FANG1, Ao ZHANG2、*, and Jian-Jun GAO2
Author Affiliations
  • 1The 13th Research Institute,CETC,Shijiazhuang 050051,China
  • 2School of Physics and Electronic Science,East China Normal University,Shanghai 200241,China
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    References(10)

    [1] Radisic V, Leong K M K H, Mei X B et al. A 50 mW 220 GHz power amplifier module[C], 45-48(2010).

    [2] Radisic V. 220-GHz solid-state power amplifier modules[J]. IEEE Journal of Solid-State Circuits, 47, 2291-2297(2012).

    [3] Campos-Roca Y. A 200 GHz medium power amplifier MMIC in cascode metamorphic HEMT technology[J]. IEEE Microwave and Wireless Components Letters, 24, 787-789(2014).

    [4] Gritters D, Brown K, Ko E et al. 200∼260 GHz solid state amplifier with 700 mw of output power[C], 1-3(2015).

    [5] FENG Wei, LIU Ru-Qing, HU Zhi-Fu et al. W-Band InP HEMT MMIC power amplifier[J]. Semiconductor Technology.

    [6] Matsumura H, Shiba S, Sato M et al. 250∼290 GHz Amplifier in 75-nm InP HEMT technolodgy using inverted microstrip transmission line[C], 1-2(2013).

    [7] Kallfass I, Pahl P, Massler H et al. A 200-GHz monolithic integrated power amplifier in metamorphic HEMT technology[J]. IEEE Microwave and Wireless Components Letters, 19, 410-412(2009).

    [8] Campos-Roca Y, Tessmann A, Hurm V et al. A G-band cascode MHEMTmedium power amplifier[C], 1-2(2013).

    [9] Laengst J, Diebold S, Massler H et al. Balanced medium power amplifier MMICs from 200 to 270 GHz[C], 1-3(2013).

    [10] Reed T B, Griffith Z, Rowell P et al. A 180-mW InP HBT power amplifier MMIC at 214-GHz[C], 1-4(2013).

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    Yan CHEN, Fan-Zhong MENG, Yuan FANG, Ao ZHANG, Jian-Jun GAO. Design of 220 GHz power amplifier based on 90 nm InP HEMT process[J]. Journal of Infrared and Millimeter Waves, 2022, 41(6): 1037

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    Paper Information

    Category: Research Articles

    Received: May. 11, 2022

    Accepted: --

    Published Online: Feb. 6, 2023

    The Author Email: Ao ZHANG (aozhang@ntu.edu.cn)

    DOI:10.11972/j.issn.1001-9014.2022.06.013

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