Photonics Research, Volume. 13, Issue 10, 2831(2025)
On-chip multi-band mode-division multiplexed optical interconnect using ultra-broadband inverse-designed digital metamaterials
[2] S. Naffziger. Innovations for energy efficient generative AI. International Electron Devices Meeting (IEDM), 1-4(2023).
[8] G. Michelogiannakis, Y. Arafa, B. Cook. Efficient intra-rack resource disaggregation for HPC using co-packaged DWDM photonics. IEEE International Conference on Cluster Computing (CLUSTER), 158-172(2023).
[31] X. Zhao, S. Escobar-Landero, D. Le Gac. 200.5 Tb/s transmission with S+C+L amplification covering 150 nm bandwidth over 2 × 100 km PSCF spans. European Conference on Optical Communication (ECOC), 1-4(2022).
[43] A. Sun, X. Deng, S. Xing. Inverse design of a broadband and compact silicon three-mode multiplexer for on-chip optical interconnect with a 705 nm bandwidth. Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC), 1-3(2024).
[53] M. Rakowski, C. Meagher, K. Nummy. 45 nm CMOS — silicon photonics monolithic technology (45CLO) for next-generation, low power and high speed optical Interconnects. Optical Fiber Communications Conference and Exhibition (OFC), 1-3(2020).
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Aolong Sun, Qiyuan Li, Yuqin Yuan, Xuyu Deng, Hua Tan, An Yan, Sizhe Xing, Junhui Hu, Ouhan Huang, Fangchen Hu, Ziwei Li, Jianyang Shi, Chao Shen, Li Shen, Wei Chu, Haiwen Cai, Nan Chi, Junwen Zhang, "On-chip multi-band mode-division multiplexed optical interconnect using ultra-broadband inverse-designed digital metamaterials," Photonics Res. 13, 2831 (2025)
Category: Silicon Photonics
Received: Mar. 17, 2025
Accepted: Jun. 19, 2025
Published Online: Sep. 22, 2025
The Author Email: Junwen Zhang (junwenzhang@fudan.edu.cn)
CSTR:32188.14.PRJ.562457