Photonics Research, Volume. 13, Issue 10, 2831(2025)

On-chip multi-band mode-division multiplexed optical interconnect using ultra-broadband inverse-designed digital metamaterials

Aolong Sun1, Qiyuan Li2, Yuqin Yuan1, Xuyu Deng1, Hua Tan1,3, An Yan1, Sizhe Xing1, Junhui Hu1, Ouhan Huang1, Fangchen Hu3,4, Ziwei Li1, Jianyang Shi1, Chao Shen1, Li Shen2,5, Wei Chu3, Haiwen Cai3, Nan Chi1, and Junwen Zhang1、*
Author Affiliations
  • 1School of Information Science and Technology, Fudan University, Shanghai 200433, China
  • 2Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, China
  • 3Zhangjiang Laboratory, Shanghai 201210, China
  • 4e-mail: hufc@zjlab.ac.cn
  • 5e-mail: lishen@hust.edu.cn
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    References(53)

    [2] S. Naffziger. Innovations for energy efficient generative AI. International Electron Devices Meeting (IEDM), 1-4(2023).

    [8] G. Michelogiannakis, Y. Arafa, B. Cook. Efficient intra-rack resource disaggregation for HPC using co-packaged DWDM photonics. IEEE International Conference on Cluster Computing (CLUSTER), 158-172(2023).

    [31] X. Zhao, S. Escobar-Landero, D. Le Gac. 200.5 Tb/s transmission with S+C+L amplification covering 150 nm bandwidth over 2 × 100 km PSCF spans. European Conference on Optical Communication (ECOC), 1-4(2022).

    [43] A. Sun, X. Deng, S. Xing. Inverse design of a broadband and compact silicon three-mode multiplexer for on-chip optical interconnect with a 705 nm bandwidth. Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC), 1-3(2024).

    [53] M. Rakowski, C. Meagher, K. Nummy. 45 nm CMOS — silicon photonics monolithic technology (45CLO) for next-generation, low power and high speed optical Interconnects. Optical Fiber Communications Conference and Exhibition (OFC), 1-3(2020).

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    Aolong Sun, Qiyuan Li, Yuqin Yuan, Xuyu Deng, Hua Tan, An Yan, Sizhe Xing, Junhui Hu, Ouhan Huang, Fangchen Hu, Ziwei Li, Jianyang Shi, Chao Shen, Li Shen, Wei Chu, Haiwen Cai, Nan Chi, Junwen Zhang, "On-chip multi-band mode-division multiplexed optical interconnect using ultra-broadband inverse-designed digital metamaterials," Photonics Res. 13, 2831 (2025)

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    Paper Information

    Category: Silicon Photonics

    Received: Mar. 17, 2025

    Accepted: Jun. 19, 2025

    Published Online: Sep. 22, 2025

    The Author Email: Junwen Zhang (junwenzhang@fudan.edu.cn)

    DOI:10.1364/PRJ.562457

    CSTR:32188.14.PRJ.562457

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