Acta Physica Sinica, Volume. 69, Issue 4, 048103-1(2020)

Study on the effect of thermal annealing process on ohmic contact performance of AuGeNi/n-AlGaInP

Su-Jie Wang, Shu-Qiang Li*, Xiao-Ming Wu, Fang Chen, and Feng-Yi Jiang
Author Affiliations
  • National Institute of LED on Si Substrate, Nanchang University, Nanchang 330047, China
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    References(23)

    [4] Kish F A, Steranka F M, Defevere D C, Vanderwater D A, Park K G, Kuo C P, Osentowski T D, Peanasky M J, Yu J G, Fletcher R M[J]. Appl. Phys., 64, 2839(1994).

    [5] Liu Z K, Gao W, Xu C[J]. J. Semicond., 31, 52(2010).

    [10] Carroll J E[J]. IET. Power. Electron., 23, 841(1977).

    [12] Kumar D[J]. Phys. Status Solidi A, 139, 433(2006).

    [15] Wang G X, Tao X X, Xiong C B, Liu J L, Feng F F, Zhang M, Jiang F Y[J]. Acta. Phys. Sin., 60, 808(2011).

    [17] Liu E K, Zhu B S, Luo J S[J]. The Physics of Semiconductors 7th  Ed., 204(2001).

    [20] Guo W L, Qian K W, Wang J X[J]. LED Devices and Technology, 76(2005).

    [22] Farmanbar M, Brocks G[J]. Adv. Electron. Mater., 2, 4(2016).

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    Su-Jie Wang, Shu-Qiang Li, Xiao-Ming Wu, Fang Chen, Feng-Yi Jiang. Study on the effect of thermal annealing process on ohmic contact performance of AuGeNi/n-AlGaInP[J]. Acta Physica Sinica, 2020, 69(4): 048103-1

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    Paper Information

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    Received: Nov. 9, 2019

    Accepted: --

    Published Online: Nov. 17, 2020

    The Author Email:

    DOI:10.7498/aps.69.20191720

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