Chinese Journal of Lasers, Volume. 48, Issue 8, 0802017(2021)

Controlling of Diameter and Taper in Ultrafast Laser Helical Drilling

Zhanwen A1,2、*, Lingling Chen1, Ying Wu1, Rongbao Du1, Hailin Bai1, and Guisheng Zou1
Author Affiliations
  • 1Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
  • 2School of Mechanical Engineering, Qinghai University, Xining, Qinghai 810016, China
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    References(22)

    [1] Rahman Z, Das A K, Chattopadhyaya S. Microhole drilling through electrochemical processes: a review[J]. Materials and Manufacturing Processes, 33, 1379-1405(2018).

    [12] Karimelahi S, Abolghasemi L, Herman P R. Rapid micromachining of high aspect ratio holes in fused silica glass by high repetition rate picosecond laser[J]. Applied Physics A, 114, 91-111(2014).

    [13] Jiang L, Liu P J, Yan X L et al. High-throughput rear-surface drilling of microchannels in glass based on electron dynamics control using femtosecond pulse trains[J]. Optics Letters, 37, 2781-2783(2012).

    [16] Auerswald J, Ruckli T, Weber P et al[J]. Taper angle correction in cutting of complex micro-mechanical contours with ultra-short pulse laser Journal of Mechanics Engineering and Automation, 2016, 334-338.

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    Zhanwen A, Lingling Chen, Ying Wu, Rongbao Du, Hailin Bai, Guisheng Zou. Controlling of Diameter and Taper in Ultrafast Laser Helical Drilling[J]. Chinese Journal of Lasers, 2021, 48(8): 0802017

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    Paper Information

    Category: laser manufacturing

    Received: Dec. 1, 2020

    Accepted: Feb. 23, 2021

    Published Online: Mar. 24, 2021

    The Author Email: A Zhanwen (azw19@mails.tsinghua.edu.cn)

    DOI:10.3788/CJL202148.0802017

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