Journal of Inorganic Materials, Volume. 37, Issue 6, 585(2022)
Figures & Tables(8)
1. Connectivities of piezoelectric ceramics and schematic pictures of common AM techniques applied for preparing piezoelectric ceramics
3. Design of piezoelectric metamaterials for tailorable piezoelectric charge constants[44]
4. Macrostructure, microstructure and application of piezoelectric ceramics prepared by direct ink writing
5. Different heights of pillar arrays made by ink-jet printing[71]
6. Macrostructures and microstructures of samples prepared by fused deposition modelling
Table 1. Comparison of advantages and disadvantages and composition of the feedstocks among several AM techniques applied in ceramics
View tableView in ArticleTable 1. Comparison of advantages and disadvantages and composition of the feedstocks among several AM techniques applied in ceramics
AM techniques Advantages Disadvantages Ingredients of raw materials Binder system Ref. Vat photo- polymerization (VP) Low surface roughness, high printing accuracy High cost of ceramic paste and machine, low degree of open source Photosensitive polymer + ceramic powder/ceramic precursor Photosensitive polymer [ 18 -20 ]Direct ink writing (DIW) Open source, multi-materials printing Clogging of nozzles, high surface roughness Powder + polymer solution (high viscosity)/ceramic precursor Water/oil based [ 21 -22 ]Inkjet printing (IP) Open source, high printing accuracy Low solids loading, easy precipitation of the particles Powder + polymer solution (low viscosity)/ceramic precursor Water/oil based [ 23 -25 ]Fused deposition modelling (FDM) Open source, low cost of the machine Low relative density, low accuracy Ceramic powder + polymer (filament) Thermal plastic polymers [ 26 -28 ]Binder jetting (BJ) High quality, gradient materials High cost of machine, reuse of the powder bed Powder bed + polymer solution Water/oil based [ 29 ]
Table 2. Functional properties of piezoelectric ceramics made by AM
View tableView in ArticleTable 2. Functional properties of piezoelectric ceramics made by AM
Material AM techniques Connectivities εr tanδ Poling conditions d33/(pC·N-1) kt Ref. BT VP 1-3 1350 - 30 kV·cm-1, 100 ℃ 30 min 160 0.474 [ 40 ]BT VP 1-3 920 0.07 2 V·μm-1, 120 ℃ 30 min 87 0.3 [ 19 ]PZT VP 1-3 1040 0.020 30-40 kV·cm-1, 70 ℃ 15 min, silicone oil 345 0.53 [ 45 ]PZT DIW Concentric ring 1081 - 25 kV·cm-1, room temperature 30 min 496 - [ 57 ]KNN DIW 3-3 1775 - 2.5 kV·mm-1, 100 ℃ 20 min, silicone oil 280 - [ 58 ]BT DIW Bulk 4730 0.033 0.66 MV·m-1, 80 ℃ 15 h, silicon oil 200 - [ 60 ]BCZT DIW 3-3 1046 0.021 3 kV·mm-1, room temperature 30 min, silicon oil (100±4) - [ 63 ]Nb-PZT IP 2-2 ~700 ~0.04 4 kV·mm-1, 120 ℃ 40 min, silicon oil - 0.46 [ 77 ]PZT FDM 3-3 700 - 25 kV, 70 ℃ 15-20 min, Corona technique (290±10) 0.5 [ 85 ]PZT FDM 2-2 627 0.023 26 kV, 60 ℃ 15 min, Corona technique (397±16) 0.68, 0.32(kp) [ 86 ]
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Bo NAN, Jiadong ZANG, Wenlong LU, Tingwang YANG, Shengwei ZHANG, Haibo ZHANG.
Paper Information
Category: REVIEW
Received: Jun. 7, 2021
Accepted: --
Published Online: Jan. 10, 2023
The Author Email: Haibo ZHANG (hbzhang@hust.edu.cn)
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