Chinese Journal of Lasers, Volume. 46, Issue 9, 903002(2019)

High-Precision Transmission-Wavefront-Processing Technology of Large Aperture Ti∶sapphire Crystal at Full Spatial Frequency

Jin shouping1, Fu Yuegang1、*, Jin Yuhao2, and Hao Zhixu1
Author Affiliations
  • 1School of Opto-Electronic Engineering, Changchun University of Science and Technology,Changchun, Jilin 130022, China
  • 2Taiyuan University of Technology, Taiyuan, Shanxi 0 30024, China
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    Figures & Tables(19)
    Ti∶sapphire crystal
    Phenomenon that interference fringes cannot be resolved due to birefringence produced by detection light transmitted from crystal. (a) Interference fringe; (b) transmission wavefront
    Schematic of using Ti∶sapphire crystal
    Schematic of orthogonal polarization detecting system
    Two sides of surface accuracy after rough polishing by single-spindle machine. (a) Surface accuracy of side S1 after rough polishing; (b) surface accuracy of side S2 after rough polishing
    Polishing results of copper pad. (a) Copper pad after polishing; (b) surface of copper pad
    Measurement results of transmission wavefront of sample after rough polishing by single-spindle machine
    Measurement results of surface roughness of sample. (a) Surface roughness of sample after rough polishing; (b) surface roughness of sample after fine polishing
    Surface roughness of Ti∶sapphire crystal
    Results of fine polishing by small grinding head. (a) Transmission wavefront of sample after fine polishing by small grinding head; (b) power spectral density at mid-spatial frequency (spatial period is 2.5-33 mm)
    Schematic of smoothing process
    Results of smoothing. (a) Transmission wavefront of Ti∶sapphire sample after smoothing; (b) power spectral density after smoothing (spatial period is 2.5-33 mm)
    • Table 1. Experimental parameters of grinding and polishing of single-spindle machine

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      Table 1. Experimental parameters of grinding and polishing of single-spindle machine

      ProcesAbrasivesAbrasive disc(Ф120 mm)Diametersize /μmTime /minSpeed /(r·min-1)Force /N
      GrindingDiamondpowderIron plate20.0303510
      DiamondpowderAluminumplate10.040355
      Rough polishingDiamondpowderResincopper plate2.0120305
      Fine polishingDiamondpowderPolyurethaneplate2.0120252.5
      Silica solResincopper plate0.120252.5
    • Table 2. Experimental parameters of small-grinding-head polishing

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      Table 2. Experimental parameters of small-grinding-head polishing

      ProcessLapping andpolishing plateAbrasivesDiametersize /μmTime /minPressure /PaRevolution /(r·min-1)Rotation /(r·min-1)
      RoughpolishingResincopper plateDiamondpowder2.09701000050100
      FinepolishingPolyurethaneplateDiamondpowder2.077050004090
      Super smoothResincopper plateSilica sol0.16050000125
    • Table 3. Orthogonal experimental factors and horizontal distribution table

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      Table 3. Orthogonal experimental factors and horizontal distribution table

      FactorPolishing plate(A)Pressure (B) /PaRotational speed (C) /(r·min-1)Silica sol concentration (D)
      Level 1Resin copper plate50001001∶1
      Level 2Pitch lap60001252∶1
      Level 3Polyurethaneplate80001504∶1
    • Table 4. Orthogonal experimental scheme and results

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      Table 4. Orthogonal experimental scheme and results

      SerialnumberABCDRMS /nmDefect rate(10-3 mm-1)
      111110.3801.6
      212220.4012.2
      313330.5252.4
      421230.8121.6
      522310.7171.8
      623120.9772.0
      731320.9951.8
      832131.1172.6
      933211.0002.8
    • Table 5. Results of range analysis

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      Table 5. Results of range analysis

      FactorABCD
      RMS0.4270.1050.0870.119
      Defect rate0.470.640.130.13
    • Table 6. Calculation results of grey relational analysis degree

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      Table 6. Calculation results of grey relational analysis degree

      FactorLevelGreyrelationalcoefficientGreyrelationaldegree
      RMSDefect
      10.9190.70.81
      A20.5540.8360.695
      30.4580.5730.516
      10.6790.9380.809
      B20.6710.630.651
      30.5810.5410.561
      10.6370.7230.68
      C20.6650.6960.681
      30.6290.710.67
      10.6970.7480.723
      D20.640.7030.672
      30.5940.6580.626
    • Table 7. Smoothing parameters of small grinding head

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      Table 7. Smoothing parameters of small grinding head

      ParameterContent
      Polishing plateResincopper plate
      AbrasivesSilica sol
      Diameter size /μm0.1
      Pressure /Pa5000
      Rotating speed of smoothing plate /(r·min-1)42
      Rotation speed of C-spindle /(r·min-1)33
      Moving range /mm-30 to 30
      Moving speed /(mm·min-1)273
      Time /min7.3
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    Jin shouping, Fu Yuegang, Jin Yuhao, Hao Zhixu. High-Precision Transmission-Wavefront-Processing Technology of Large Aperture Ti∶sapphire Crystal at Full Spatial Frequency[J]. Chinese Journal of Lasers, 2019, 46(9): 903002

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    Paper Information

    Category: materials and thin films

    Received: Mar. 11, 2019

    Accepted: --

    Published Online: Sep. 10, 2019

    The Author Email: Yuegang Fu (fuyg@cust.edu.cn)

    DOI:10.3788/CJL201946.0903002

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