Acta Optica Sinica, Volume. 44, Issue 11, 1112001(2024)
Full-Field Thickness-Direction Strain Measurement Based on Multispectral Digital Image Correlation
Fig. 1. Schematic of the measuring device. (a) Single camera multispectral measurement system; (b) traditional four-camera measurement system
Fig. 4. Schematic of strain measurement along thickness direction. (a)(b) Local coordinate system and its enlarged view; (c) front and back surfaces with the same calculated areas
Fig. 5. Thin plate morphology. (a) Three-dimensional morphology of 3.3 mm thin plate; (b) three-dimensional morphology of 4.3 mm thin plate; (c) semi-cylindrical three-dimensional morphology
Fig. 6. Experimental setup diagram. (a) Experimental setup; (b) experimental specimen
Fig. 7. Real time speckle image. (a) Color image; (b) blue and red channel subimages; (c) two subimages of the left image; (d) two subimages of the right image
Fig. 8. Full-field strain along thickness direction. (a) Strain distribution along thickness direction at T1=153 s; (b) strain distribution along thickness direction at T2=173 s; (c) strain distribution along thickness direction at T3=193 s
Fig. 9. Trend of strain variation along thickness direction. (a) Distribution of calculation points; (b) strain-time curves along thickness direction
|
Get Citation
Copy Citation Text
Huatao Zhao, Xinqiao Tang, Zhenning Chen. Full-Field Thickness-Direction Strain Measurement Based on Multispectral Digital Image Correlation[J]. Acta Optica Sinica, 2024, 44(11): 1112001
Category: Instrumentation, Measurement and Metrology
Received: Jan. 4, 2024
Accepted: Mar. 8, 2024
Published Online: Jun. 17, 2024
The Author Email: Chen Zhenning (zhenning.chen@nuaa.edu.cn)
CSTR:32393.14.AOS240446