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APPLIED LASER, Volume. 43, Issue 2, 93(2023)

Study on the Processing of Wafer Marking Based on General F-Theta Lens and Telecentric F-Theta Lens

Shu Tianjiao1,2、*, Du Yuanchao1,2, Li Guoqi1,2, Chen Yuan1,2, Zhang Lingling1,2, Ma Yongxin1, Gao Yinrui3, Hu Haowei3, and Chen Yu3
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    Shu Tianjiao, Du Yuanchao, Li Guoqi, Chen Yuan, Zhang Lingling, Ma Yongxin, Gao Yinrui, Hu Haowei, Chen Yu. Study on the Processing of Wafer Marking Based on General F-Theta Lens and Telecentric F-Theta Lens[J]. APPLIED LASER, 2023, 43(2): 93

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    Received: Aug. 18, 2022

    Accepted: --

    Published Online: Mar. 30, 2023

    The Author Email: Tianjiao Shu (1106679388@qq.com)

    DOI:10.14128/j.cnki.al.20234302.093

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology