Fig. 1. Effect of silicon wafer thickness on transfer characteristic. (a) Reflectivity; (b) transmissivity

Fig. 2. Structural diagrams of FSS. (a) Minimum cell structure of metal grid; (b) overall diagram of FSS structure corresponding to single layer metal grid

Fig. 3. Equivalent circuit model of FSS structure

Fig. 4. Effect of number of metal grid layers on transfer characteristic. (a) Reflectivity; (b) transmissivity

Fig. 5. Effect of metal grid structure parameters on transfer characteristic. (a) Period; (b) line width; (c) hole radius; (d) grid thickness; (e) rectangular length; (f) rectangular width

Fig. 6. Transfer characteristic of FSS structure under optimal parameters

Fig. 7. Vector diagrams of current density and electric field intensity. (a) Current density; (b) electric field intensity

Fig. 8. Effect of incident offset angle θ on transfer characteristic. (a) Reflectivity; (b) transmissivity

Fig. 9. Filter processing results. (a) Surface of filter; (b) micrograph of metal grid

Fig. 10. Comparison of real transfer characteristic with simulated transfer characteristic. (a) Reflectivity; (b) transmissivity