Optoelectronic Technology, Volume. 44, Issue 2, 159(2024)
Research on Lightweight and Low Power Technology of Airborne LCD Module
Figures & Tables(12)
Fig. 1. 3D model and finite element model of heat dissipation plate
Fig. 4. 3D model and finite element model of optimized heat dissipation plate
Fig. 6. Schematic of elastic pressing method for light guide plate
Fig. 9. Simulation results of the backlight component using 3014 packaged LED
Fig. 10. Simulation results of the backlight component using 4014 packaged LED
Table 1. The main indicators of two types LED
View tableView in ArticleTable 1. The main indicators of two types LED
白色LED 封装外形/ （mm×mm×mm） 额定电流/mA 额定功率/mW I＝120 mA
光通量/lm
半功率角/(°) I＝80 mA
光效率/（lm·W-1）
3014封装 3×1.4×0.6 200 680（单管芯） 51 60 168 4014封装 4×1.4×0.6 200 1 320（双管芯） 100 60 160
Table 2. Weight and power consumption of the LCD module before and after improvement
View tableView in ArticleTable 2. Weight and power consumption of the LCD module before and after improvement
液晶显示模组 散热板
重量/g
导光板
厚度/mm
中心白场亮度/（cd·m-2） 背光功耗/W 改进前 327 3 1 000 36.5 改进后 275 2 1 000 29.2
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Huasong ZHANG, Ziyue YAN, Liang HU, Qian LU, Jie WANG. Research on Lightweight and Low Power Technology of Airborne LCD Module[J]. Optoelectronic Technology, 2024, 44(2): 159
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Received: Oct. 26, 2023
Accepted: --
Published Online: Jul. 19, 2024
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