Optoelectronic Technology, Volume. 42, Issue 3, 222(2022)

Study on Active Optoelectronic Device Packaging Technology and Reliability

Jian FAN, Zhenxing WU, Xiaoxia LU, Aijie XUE, and Jun GAO
Author Affiliations
  • The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 210016, CHN
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    References(3)

    [10] Dietz R L. Sealing optical fibers without metallization: Design guidelines[C], 5454, 111-120(2004).

    [11] Galeotti R, Shaw M, Musio M et al. Use of glass solder in fixing an optical fiber in a laser package[C], 142-153(4652).

    [21] Shaw M, Galeotti R, Coppo G. Method of fixing an optical fibre in a laser package[C], 2001, 1411-1446.

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    Jian FAN, Zhenxing WU, Xiaoxia LU, Aijie XUE, Jun GAO. Study on Active Optoelectronic Device Packaging Technology and Reliability[J]. Optoelectronic Technology, 2022, 42(3): 222

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    Paper Information

    Category: Study Report

    Received: Mar. 20, 2022

    Accepted: --

    Published Online: Dec. 23, 2022

    The Author Email:

    DOI:10.19453/j.cnki.1005-488x.2022.03.012

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