Optoelectronic Technology, Volume. 42, Issue 3, 222(2022)
Study on Active Optoelectronic Device Packaging Technology and Reliability
The technical approaches and reliability of the active optoelectronic devices were studied, including coaxial and box-type package structure, electrical and optical parts attachment materials and fiber coupling system.The characteristics of attachment material for electrical parts and cementing material for optical parts were compared and analyzed. The structural characteristics of direct and indirect coupling in fiber coupling system were described,as well as the optical window sealing technologies in indirect coupling,three sealing methods and reliability of fiber and pigtail ferrule in direct coupling.In addition, several reliability verification methods were presented, aiming at the typical failure modes of active optoelectronic devices.
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Jian FAN, Zhenxing WU, Xiaoxia LU, Aijie XUE, Jun GAO. Study on Active Optoelectronic Device Packaging Technology and Reliability[J]. Optoelectronic Technology, 2022, 42(3): 222
Category: Study Report
Received: Mar. 20, 2022
Accepted: --
Published Online: Dec. 23, 2022
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