Acta Optica Sinica, Volume. 44, Issue 15, 1513010(2024)

On-Chip Semiconductor Lasers for Silicon Photonics (Invited)

Ruijun Wang, Yu Han*, and Siyuan Yu**
Author Affiliations
  • School of Electronics and Information Technology, State Key Laboratory of Optoelectronic Materials and Technologies, Sun Yat-sen University, Guangzhou 510275, Guangdong , China
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    Figures & Tables(10)
    Hybrid integrated laser based on flip-chip bonding[14]. (a) Schematic of flip-chip bonding of InP semiconductor laser on a silicon photonics integrated circuit; (b) SEM image of flip-chipped laser diode; (c) experimental results of placement statistics in X and Y directions; (d) schematic of process flow
    Hybrid integrated laser based on micro-transfer printing[17]. (a) Schematic of hybrid integration of Ⅲ-V optoelectronic devices on a silicon photonics wafer by micro-transfer printing in a parallel manner; (b) schematic of process flow of micro-transfer printing
    Microscope image of Ⅲ-V-semiconductor-based optical amplifier coupons with tethers[19]
    Heterogeneously integrated laser based on bonding technology. (a) Ⅲ-V epitaxial materials heterogeneously integrated on a silicon photonics wafer via bonding[25]; (b) SEM image of cross section of a Ⅲ-V semiconductor laser heterogeneously integrated on a SOI waveguide[27]
    Optical coupling strategy of heterogeneously integrated lasers. (a) Schematic of heterogeneously integrated Ⅲ-V-on-silicon laser with light mainly confined in the silicon waveguide[28]; (b) schematic of heterogeneously integrated Ⅲ-V-on-silicon laser with light mainly confined in the active region[29]
    Performance of heterogeneously integrated lasers demonstrated by Intel[30]. (a) Optical power in the silicon waveguide versus current characteristics of a heterogeneously integrated Ⅲ-V-on-silicon laser at different temperatures; (b) output spectra of an 8λ DFB laser array; (c) relative drift of bias current for 10 mW laser output power for 36 heterogeneously integrated Ⅲ-V-on-silicon lasers operating at 80 ℃
    Blanket and selective heteroepitaxy of Ⅲ-V compound semiconductor on Si. (a) Blanket heteroepitaxy; (b) selective heteroepitaxy
    Monolithic integration of Ⅲ-V laser heteroepitaxy on Si based on vertical epitaxy. (a)(b) Monolithic integration of GaAs-based lasers on Si via blanket heteroepitaxy and butt coupling[48]; (c)(d) monolithic integration of GaAs-based nano-ridge lasers on Si via selective heteroepitaxy and evanescent coupling[55-56]
    Ⅲ-V laser integration on Si via lateral heteroepitaxy. (a) 3D schematic of selective lateral heteroepitaxy; (b) optically-pumped Ⅲ-V laser array grown on Si[67]; (c) Ⅲ-V photodetector array grown on Si[68]
    • Table 1. Comparison of different integration approaches

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      Table 1. Comparison of different integration approaches

      Integration approachWafer scale integrationActive-passive optical couplingHeat dissipationLaser performanceIndustrial maturity
      Flip-chip bonding★★★★★★★★★★★
      Transfer Printing★★★★★★★★
      Wafer Bonding★★★★★★★★★★★★★
      Blanket heteroepitaxy★★★★★★★★★★★
      Selective vertical epitaxy★★★★★★★★★
      Selective lateral epitaxy★★★★★★★★★★
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    Ruijun Wang, Yu Han, Siyuan Yu. On-Chip Semiconductor Lasers for Silicon Photonics (Invited)[J]. Acta Optica Sinica, 2024, 44(15): 1513010

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    Paper Information

    Category: Integrated Optics

    Received: May. 7, 2024

    Accepted: Jul. 8, 2024

    Published Online: Aug. 5, 2024

    The Author Email: Han Yu (hany87@mail.sysu.edu.cn), Yu Siyuan (yusy@mail.sysu.edu.cn)

    DOI:10.3788/AOS240976

    CSTR:32393.14.AOS240976

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