Electro-Optic Technology Application, Volume. 40, Issue 3, 69(2025)

Influence of Milling-Grinding Processes on Surface Roughness of Silicon Lenses

LI Mingzhi, LIU Qing, FENG Shuochun, and LIU Yan
Author Affiliations
  • The 46 Research Institute, CETC, Tianjin, China
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    References(4)

    [4] [4] JIAN W, WANG Z X, JIN P, et al. Subsurface damage and bending strength analysis for ultra-thin and flexible silicon chips[J]. Science China Technological Sciences, 2023, 66(1): 215-222.

    [6] [6] SILVA R, TEICHER U, NESTLER A, et al. Finite element modeling of chip separation in machining cellular metals[J]. Advances in Manufacturing, 2015, 3(1): 54-62.

    [7] [7] MATOUSEK O, TOMKA D, PROCHASKA F, et al. Influence of the circumferential speed of a resin bond grinding wheel on the properties of a ground aspheric surface[J]. Proceedings of SPIE, 2015, 9442: 94420T.

    [12] [12] LU S X, GAO H, BAO Y J, et al. A model for force prediction in grinding holes of SiCp/Al composites[J]. International Journal of Mechanical Sciences, 2019, 160: 1-14.

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    LI Mingzhi, LIU Qing, FENG Shuochun, LIU Yan. Influence of Milling-Grinding Processes on Surface Roughness of Silicon Lenses[J]. Electro-Optic Technology Application, 2025, 40(3): 69

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    Paper Information

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    Received: Jan. 9, 2025

    Accepted: Sep. 5, 2025

    Published Online: Sep. 5, 2025

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