Bonding-Surface-Cleaning Technology for Preparing Piezoelectric Single-Crystal Thin-Film Wafer

LIU Shanqun; DING Yuchong; CHEN Zheming; SHI Zibin; LONG Yong; ZOU Shaohong; YU Guiqiu; ZHANG Li

doi:10.11977/j.issn.1004-2474.2024.05.015

Piezoelectrics & Acoustooptics, Volume. 46, Issue 5, 700(2024)

Bonding-Surface-Cleaning Technology for Preparing Piezoelectric Single-Crystal Thin-Film Wafer

LIU Shanqun, DING Yuchong, CHEN Zheming, SHI Zibin, LONG Yong, ZOU Shaohong, YU Guiqiu, and ZHANG Li

Author Affiliations

The 26th Institute of China Electronics Technology Group Corporation, Chongqing 400060, China

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LIU Shanqun, DING Yuchong, CHEN Zheming, SHI Zibin, LONG Yong, ZOU Shaohong, YU Guiqiu, ZHANG Li. Bonding-Surface-Cleaning Technology for Preparing Piezoelectric Single-Crystal Thin-Film Wafer[J]. Piezoelectrics & Acoustooptics, 2024, 46(5): 700

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Paper Information

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Received: Aug. 25, 2024

Accepted: Jan. 17, 2025

Published Online: Jan. 17, 2025

The Author Email:

DOI:10.11977/j.issn.1004-2474.2024.05.015

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology