Laser & Infrared, Volume. 55, Issue 1, 102(2025)

Optical system analysis and heat dissipation design of high-power laser direct writing equipment

HU Xing-tao1,2, TIAN Lei-lei1, TONG Bao-hong2, MIAO Si-zhong1, ZHOU Shuo1, LI Fan1, CHEN Kun3、*, and WANG Ru1
Author Affiliations
  • 1School of Mechanical Engineering, Anhui Institute of Information Technology, Wuhu 241000, China
  • 2School of Mechanical Engineering, Anhui University of Technology, Maanshan 243032, China
  • 3School of Mechanical And Automotive Engineering, Anhui Polytechaic University, Wuhu 241000, China
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    References(7)

    [1] [1] Huang L, Hong Z, Chen Q D, et al. Imaging/nonimaging microoptical elements and stereoscopic systems based on femtosecond laser direct writing[J]. Light: Advanced Manufacturing, 2024, 4(4): 543-569.

    [2] [2] Gonzalez-Hernandez D, Varapnickas S, Bertoncini A, et al. Micro-optics 3D printed via multi-photon laser lithography[J]. Advanced Optical Materials, 2023, 11(1): 2201701.

    [5] [5] Zuo J, Lin X. High-power laser systems[J]. Laser Photonics Rev, 2022, 16(5): 2100741.

    [8] [8] Chung H, Zhang F, Li H, et al. Inverse design of high-NA metalens for maskless lithography[J]. Nanophotonics, 2023, 12(13): 2371-2381.

    [9] [9] Hornbeck L J. Digital Light Processing for high-brightness, high-resolution applications[J]. Proc. of SPIE, 1997, 3013: 27-40.

    [16] [16] Syu Y S, Huang Y B, Jiang M Z, et al. Maskless lithography for large area patterning of three-dimensional microstructures with application on a light guiding plate[J]. Opt. Express, 2023, 31(8): 12232-12248.

    [17] [17] Yang Z, Lin J, Liu L, et al. Genetic algorithm-based optical proximity correction for DMD maskless lithography[J]. Opt. Express, 2023, 31(14): 23598-23607.

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    HU Xing-tao, TIAN Lei-lei, TONG Bao-hong, MIAO Si-zhong, ZHOU Shuo, LI Fan, CHEN Kun, WANG Ru. Optical system analysis and heat dissipation design of high-power laser direct writing equipment[J]. Laser & Infrared, 2025, 55(1): 102

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    Paper Information

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    Received: Sep. 2, 2024

    Accepted: Mar. 13, 2025

    Published Online: Mar. 13, 2025

    The Author Email: CHEN Kun (535630207@qq.com)

    DOI:10.3969/j.issn.1001-5078.2025.01.016

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