Chinese Optics, Volume. 15, Issue 4, 770(2022)

Snapshot imaging spectrometer for mobile phone

Jiu-yi TIAN*
Author Affiliations
  • Shannxi Snap-spectrum Deep-light Technology Co. ltd., Xi’an 710065, China
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    Figures & Tables(15)
    Basic structure of the spectral imaging system of an array filter
    Design method of the array filter assembly
    Theoretical transmittance of 3×4 channel filter
    Process route of an array filter
    Spectral transmission test curve for the 3×4 channels
    Design results of the microlens array. (a) Simulation diagram of light tracing; (b) spatial position relationship of the 3×4 array lens; (c) simulated 3×4 array images; (d) MTF curves
    Processing effect of microlens. (a) Surface morphology; (b) contour curve
    Snapshot spectral camera (a) before assembly and (b) after assembly
    Experimental test results. (a) Optical layout; spectral images of a (b) blue, (c) white, (d) red and (e) blue object
    Spectral curve marked in Fig. 9 (b) (solid line: micro fiber spectrometer test results, dotted line: imaging spectrometer test results)
    • Table 1. Basic parameters and indicators of CMOS

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      Table 1. Basic parameters and indicators of CMOS

      芯片型号有效像素图像区域最低照度视频制式
      1/3 CMOS760(H)×586(V)4.8 mm×3.6 mm0.008 LxPAL/NTSC
    • Table 2. Performance comparison of the filters

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      Table 2. Performance comparison of the filters

      序号光谱范围/nm通道个数半高宽/nm平均峰值透过率/%主要结构参考文献
      1470~62012~10~85介质高反/二氧化硅/介质高反[27]
      2722~8801281.72~3.84~45%介质高反/二氧化硅/介质高反[26]
      3415~7258~81~68.9Ag高反/ 光刻胶 /Ag高反[14]
      4400~8005~100~45Al 超表面[28]
      5460~6309~2771.2Ag高反/ 光刻胶 /Ag高反[14]
      6530~68012~883介质高反/二氧化硅/介质高反本工作
    • Table 3. Parameters of the UV adhesive

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      Table 3. Parameters of the UV adhesive

      名称粘度 25 °C 固化后 折射率 拉伸极限弹性模量(PSI)抗拉强度(PSI)
      NOV61300 cps1.5638%1500003000
    • Table 4. Basic gluing process and parameters

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      Table 4. Basic gluing process and parameters

      光源波长光功率密度预固化时间固化时间点胶设备
      365 nm700 mW/cm230 s>10 min尔谷光电(JZ04-365-04)
    • Table 5. Comparison of technical indexes of the imaging spectrometer

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      Table 5. Comparison of technical indexes of the imaging spectrometer

      序号结构光谱分辨率/nm时间分辨率整体尺寸/mm光谱图像获取方式报道时间/年参考文献
      1芯片滤光阵列10和CMOS芯片同步11.2×11.2,不带镜头直接获取2014[27]
      2子孔径复合阵列滤光片10计算重构原理样机平台搭建计算重建2019[31]
      3子孔径复合阵列滤光片50计算重构原理样机平台搭建计算重建2004[32]
      4芯片滤光阵列10和CMOS芯片同步实物样机 约几十mm 直接获取2019[33]
      5傅立叶变换成像光谱仪//原理设计计算重构2020[8]
      6芯片滤光阵列计算超分后5.2 nm计算重构原理样机平台搭建计算重构2021[22]
      7子孔径复合阵列滤光片8和CMOS芯片同步功能样机Φ6×6直接获取2022本工作
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    Jiu-yi TIAN. Snapshot imaging spectrometer for mobile phone[J]. Chinese Optics, 2022, 15(4): 770

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    Paper Information

    Category: Original Article

    Received: Dec. 6, 2021

    Accepted: --

    Published Online: Sep. 6, 2022

    The Author Email:

    DOI:10.37188/CO.2021-0209

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