Chinese Optics Letters, Volume. 2, Issue 11, 11654(2004)
Research on film thickness of conductive line formed by laser micro-fine cladding and flexibly direct writing technique
[1] [1] Z. H. Wang, Semiconductor Information (in Chinese) 37, 21 (2000).
[2] [2] D. B Chrisey, Science 289, 879 (2000).
[3] [3] K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).
[4] [4] R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).
[5] [5] H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).
[6] [6] S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).
[7] [7] D. Dimos, B. H. King, and P. Yang, in Proceedings of 1999 International Symposium on Advanced Packaging Materials 186 (1999).
[8] [8] J. W. Liu and X. Y. Zeng, Laser Journal (in Chinese) 22, 15 (2001).
[9] [9] H. L. Li, X. Y. Zeng, and X. Y. Li, Chin. J. Lasers (in Chinese) (to be published).
[10] [10] X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).
[11] [11] Q. Zhang and S. F. Jiang, Architectural Door-Window and Metal Building Materials (in Chinese) (10) 24 (2001).
Get Citation
Copy Citation Text
Huiling Li, Xiaoyan Zeng, Huifen Li, Xiangyou Li, Yiqun Chen, "Research on film thickness of conductive line formed by laser micro-fine cladding and flexibly direct writing technique," Chin. Opt. Lett. 2, 11654 (2004)