Fig. 1. Top-emitting VCSEL with heat dissipation hole

Fig. 2. P-I curves of 850 nm VCSEL with and without heat dissipation hole

Fig. 3. Lattice temperature of an 850 nm VCSEL with and without heat dissipation hole at different operating currents. (a) (b) Operating current is 16.3 mA; (c) (d) operating current is 17.8 mA

Fig. 4. Maximum lattice temperature of an 850 nm VCSEL with and without a heat dissipation hole with the operating current

Fig. 5. Thermal resistance of an 850 nm VCSEL with and without a heat dissipation hole with operating current

Fig. 6. Front image of chip after sputtering electrode

Fig. 7. 850 nm VCSEL power test with and without heat dissipation hole

Fig. 8. Lithographic layout for back lithography (six in a group)

Fig. 9. Slope efficiency of 850 nm VCSEL with different shapes of heat dissipation hole and without heat dissipation hole