Indium antimonide (InSb) materials have been widely used in infrared photoelectric detectors and other fields because of their special properties. With the development of larger arrays of midinfrared focal plane detectors and a growing demand for lowcost InSb infrared detectors, the desired size for the InSb wafers also increases. In this paper, a new structure of graphite rest and high precision low damage single line cutting were combined to develop a 5 inch InSb crystal oriented segmentation. Low damage edge chamfering techniques while optimizing grinding parameters were used to improve the grinding of 5 inch InSb wafers. An optimized mounting process were used to further improve the flatness of polished 5 inch InSb wafers. Furthermore, the pH value and polishing solution ratio were optimized to improve the surface quality of 5 inch InSb wafers. At the same time, the crystal orientation and deviation, polished surface macroscopic quality, geometric parameters, surface roughness and lattice quality of 5 inch InSb wafers were analyzed using an Xray crystal orientation instrument and atomic force microscope. The test results show that, high quality 5 inch InSb wafers can be created more readily by this newly optimized process, helping to meet the current demand for InSb materials in IR detectors and other fields.