Acta Optica Sinica, Volume. 44, Issue 21, 2113001(2024)

Fabrication and Loss Characteristics Analysis of Multimode Curved Polymer Waveguide for Compact Board-Level Optical Interconnection

Tengfei Yao, Rongchao Huang, Hailong Liao, Guodong Wang, Hua Miao**, and Xiaofeng Liu*
Author Affiliations
  • Shennan Circuits Co., Ltd., Shenzhen 518023, Guangdong , China
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    Figures & Tables(10)
    Schematic of light ray transmission in a curved waveguide
    Change in local numerical aperture with x under different bending radii R
    Schematic of radiation loss and mode conversion loss for S-shaped waveguide
    Variation in radiation loss with the ratio z/ρ in S-shaped waveguide
    Schematics of fabricated waveguides. (a) Reference straight waveguide; (b) S-shaped waveguide with different bending radii
    Fabrication process of waveguide. (a) Fabrication of under cladding layer; (b) fabrication of waveguide core layer; (c) fabrication of upper cladding layer
    Typical waveguide morphologies. (a) SEM images of waveguide morphology; (b) cross-section micrographs of polymer waveguides observed by optical microscope; (c1) typical overhead view of three-dimensional morphology and (c2) typical sidewall of three-dimensional morphology of waveguide obtained by laser confocal microscope
    Schematic of waveguide insertion loss performance test
    Measurement results of insertion loss. (a) Insertion loss of all 60 channels in straight waveguide; (b) insertion loss of bending waveguide with different transition arcs
    Distribution of losses in fabricated S-shaped bending waveguides among the possible attenuation causes
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    Tengfei Yao, Rongchao Huang, Hailong Liao, Guodong Wang, Hua Miao, Xiaofeng Liu. Fabrication and Loss Characteristics Analysis of Multimode Curved Polymer Waveguide for Compact Board-Level Optical Interconnection[J]. Acta Optica Sinica, 2024, 44(21): 2113001

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    Paper Information

    Category: Integrated Optics

    Received: Apr. 17, 2024

    Accepted: Jun. 20, 2024

    Published Online: Nov. 20, 2024

    The Author Email: Hua Miao (Miaoh@scc.com.cn), Xiaofeng Liu (xfliucsu@163.com)

    DOI:10.3788/AOS240863

    CSTR:32393.14.AOS240863

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