Influence of Distance Between Remote Phosphor and Chip on Performance of White LEDs

Xue Zheng; Zhimou Xu; Yubo Long; Junping Chen; Xingao Liu

doi:10.3788/LOP213238

Laser & Optoelectronics Progress, Volume. 60, Issue 9, 0933001(2023)

Influence of Distance Between Remote Phosphor and Chip on Performance of White LEDs

Xue Zheng¹, Zhimou Xu^1、*, Yubo Long¹, Junping Chen², and Xingao Liu³

¹School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, Hubei, China

²Shenzhen Stronglumen Optoelectronic Co., Ltd, Shenzhen 518104, Guangdong, China

³Shenzhen Guangyou Optoelectronic Technology Co., Ltd., Shenzhen 518108, Guangdong, China

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Figures & Tables(14)

Fig. 1. Schematic cross-sectional view of white LED. (a) With conventional phosphor; (b) with remote phosphor

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Fig. 2. Simulation 3D model. (a) Side view; (b) top view

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Fig. 3. Simulation results when h is 20 μm. (a) Light intensity distribution; (b) optical power density distribution

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Fig. 4. Simulation results when h is 40 μm. (a) Light intensity distribution; (b) optical power density distribution

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Fig. 5. Simulation results when h is 60 μm. (a) Light intensity distribution; (b) optical power density distribution

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Fig. 6. Simulation results when h is 80 μm. (a) Light intensity distribution; (b) optical power density distribution

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Fig. 7. Simulation results when h is 100 μm. (a) Light intensity distribution; (b) optical power density distribution

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Fig. 8. Schematic diagram of special bracket

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Fig. 9. Flow chart of remote phosphor LED packaging

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Fig. 10. Physical pictures of remote phosphor LED lamp beads. (a)-(c) Top view of the lamp beads with low, medium and high bottom sealing glue thickness; (d)-(f) cross-sectional view of the lamp beads with low, medium and high bottom sealing glue thickness

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Table 1. Simulation results of Light Tools
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Table 1. Simulation results of Light Tools
h /μm Maximum light intensity /cd Total power /lm Efficient
20 513.78 1179.9 0.86815
40 531.48 1230.3 0.90523
60 528.79 1249.4 0.91928
80 548.68 1260.0 0.92708
100 561.24 1262.2 0.92870

Table 2. Comparison between special bracket and traditional bracket

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Table 2. Comparison between special bracket and traditional bracket

Point of improvement	Traditional bracket	Special bracket
Light angle /（°）	92/92	133.6/116.9
Distance between chip and reflective layer /mm	0.76	0.5
Thickness of silver plating /μm	0.5-1.0	2.0-2.5
Chip connection mode	in series	in parallel

Table 3. Parameters of phosphor

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Table 3. Parameters of phosphor

Material	Rare earth aluminate
Density /（g·cm^-3）	4.8±0.2
Excitation wavelength /nm	450-455
Domain wavelength /nm	570.4±0.2
Peak wavelength /nm	553±1
CIE	x=0.441±0.002； y=0.541±0.002
Peak half-width bandwidth /nm	111.5±0.5
Color purity /%	94.7±0.5
Particle size（D₅₀）/μm	23.5±1.5

Table 4. Optoelectronic performance of remote packaged LED lamp beads

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Table 4. Optoelectronic performance of remote packaged LED lamp beads

h /μm	Current /mA	Voltage /V	Power /mW	Light effect /（lm·W^-1）	Tc /K	Domain wavelength /nm	Peak wavelength /nm	Ra
19	59.867	2.7049	161.93	221.521	5067.1	565.14	452.52	71.09
90	59.9	2.7064	162.10	221.968	5115.3	564.12	452.50	71.13
107	59.9	2.6999	161.72	225.106	5042.6	564.94	452.76	70.82

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Xue Zheng, Zhimou Xu, Yubo Long, Junping Chen, Xingao Liu. Influence of Distance Between Remote Phosphor and Chip on Performance of White LEDs[J]. Laser & Optoelectronics Progress, 2023, 60(9): 0933001

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