Fig. 1. Schematic diagram of continuous polishing without workpiece

Fig. 2. (a) Distribution diagram of relative grinding length; (b) distribution diagram of contact pressure; (c) distribution of material removal quantity at different radial locations

Fig. 3. (a) Distribution diagram of contact pressure in steady state; (b) distribution of material removal quantity at different radial locations

Fig. 4. Schematic diagram of the destruction of polishing pad caused by workpiece

Fig. 5. Relationship between pad surface shape change rate and the eccentric distance of conditioning plate. (a) Workpiece with same thickness of 2 cm and different radiuses; (b) workpiece with same radius of 10 cm and different thicknesses

Fig. 6. Relationship between equilibrium position and radius, thickness of workpiece

Fig. 7. (a) Relationship between pad surface shape change rate and the eccentric distance of conditioning plate in experiment; (b) surface shape preservation in equilibrium state

Fig. 8. Relationship between equilibrium position and the size of workpiece in experiment

Fig. 9. Surface shape of the 10th workpiece for continous polishing. (a) Initial surface shape; (b) surface shape after polishing for 8 hours